THERMOBOND

The instructions for application below are for guidance only. Please always refer to any project-specific DANOSA UK recommendations. Adhesion tests should be carried out ideally a minimum of 48-hours prior to general installation works commencing.

• Ensure that all surfaces to be bonded are clean, dry and free from contamination.
• Ensure that the substrate surface is relatively flat, with no significant variations in level to prevent air gaps under the insulation board and to ensure a maximum of surface contact and that there are no fixings protruding from the deck surface. The substrate surface must be solid and capable of transferring all loadings to the structure.
• Apply THERMOBOND solvent-free insulation adhesive directly on to the substrate (deck/ AVCL/insulation board) in beads 10mm
• 20mm wide, at 200mm
• 300mm centres.
• Immediately place the insulation board directly on to the adhesive.
• Apply pressure to the insulation board to ensure full contact with the adhesive.
• Allow to cure.

All information on temperature and timings represent normal working conditions and is provided as guidance only. However, please contact DANOSA UK technical services for further advice should you wish to operate outside of these parameters.
 
 Wind uplift performance:
Roof systems constructed with THERMOBOND were tested at BRE premises by the supplier and achieved a wind uplift resistance of between 5000 Pa and 5500 Pa.